Semiconductor wafer-defect classification
Multimodal classification of wafer SEM imagery with root-cause tracing.
Evidence notice: cases, figures and inferred project metadata are unverified scenario illustrations, not established client outcomes, credentials or return promises. Signed contracts define scope, fees, baselines, acceptance and data responsibilities; client business data stays off-chain.
1. Project Overview
- Customer type
- Top-tier Process / discrete manufacturers
- Project duration
- 8–12 weeks
- Tech stack
- Multimodal backbone · Vision / OCR
- Deployment
- Hybrid cloud
2. Business Context & Pain Points
The customer is a Enterprise / Group player in Manufacturing, with the core pain concentrated in "Ops & Production". Manual workflows and point tools could not scale or stay consistent, driving up response time, operating cost and compliance risk. This project delivered an end-to-end AI upgrade for that workflow.
3. Solution
Anchored on "AI + Manufacturing", Global AI DAO integrated the following capability stack into a single solution:
- Multimodal backbone —— Wired into the critical business path across ingestion, inference and human-in-the-loop collaboration.
- Vision / OCR —— Wired into the critical business path across ingestion, inference and human-in-the-loop collaboration.
- Deployment: Hybrid cloud, balancing data compliance, performance SLA and operability.
4. Quantified Outcomes (Before vs After)
| Metric | Before | After | Delta |
|---|---|---|---|
| yield recovered | 100% | 102% | +1.6pp |
Source metric: 99.2% classification accuracy, +1.6pp yield recovered.
5. Specs & Fit
| Best for | Process / discrete / TCM / materials / new energy |
| Core capabilities | ChatBI / QC / R&D screening / scheduling |
| Deployment | Shop-floor edge + group cloud |
| Integrations | MES / ERP / SCADA / PLM |